LAPLACE-Cap€¦ · PacTech USA Inc. 328 Martin Avenue, Santa Clara, CA 95050, USA PacTech Asia...
Transcript of LAPLACE-Cap€¦ · PacTech USA Inc. 328 Martin Avenue, Santa Clara, CA 95050, USA PacTech Asia...
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www.pactech.de
PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA
PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia
PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany
Contact us at [email protected]
LAPLACE-CapHigh Accuracy Automatic Laser Bonder
for Capacitor Bonding on Wafer Probe Cards
Specification:
Capacitor Bonding and Laser Reflow for High Density Applicationswith Very Fine Component to Component Distances on SpecialSubstrates Like e.g. Wafer Probe Cards
• Capacitor feeder• Pick and place tool with 1µm resolution• Max. capacitor size: 1.25mm x 2.0mm
• Heating system with temperature controlling
• Patented laser thermode tool• Bonding direction is 180°• Requires only a thin layer of solder on the
• No additional reflow process needed• Max. working area: 325mm x 325mm• Placement accuracy: +/- 10µm• Throughput: 500 capacitors per hour
(upgradable to max.: 2.5mm x 2.5mm)
(Max. temp.: 150°C, temp. range: +/- 3°C)
(including soldering)
substrate/component pad