Internship Presentation_Faridi
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Transcript of Internship Presentation_Faridi
KIT – University of the State of Baden-Württemberg and National Large-scale Research Center of the Helmholtz Association
M.Sc. “Optics & Photonics“, November, 2013
www.kit.edu
Laser structuring of glass panel for optimized chip-to-waveguide interconnection
Fraunhofer-Institut für Zuverläsigkeit und Mikrointegration IZM Fahd Rushd Faridi
MSc. “Optics & Photonics”, November, 2014
2 Karlsruhe School of Optics & Photonics (KSOP)
Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 47880 | Fax: +49 (0)721 608 47882
Laser structuring of glass panel for optimized chip-to-waveguide interconnection
Motivation
Approach
Laser Structuring
Process Optimization
Results
Summary
3
Motivation
Problem
Ever increasing data rates in information processing systems
High energy consumption in data centers and server firms
Integration of electronic circuits is reaching its limit
Solution
Optical data transmission and optical interconnects
Challenges
Embedded optical architectures do not exist in data center and network systems
A lack of photonic system integration in printed circuit boards
Partially developed basic technologies
Karlsruhe School of Optics & Photonics (KSOP)
Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882
4
Approach
Exploring synergies using novel mix and match linkups
Prototypes are developed in three hierarchy levels of optical transmission
1st hierarchy level :
Facilitate optical transmission on a printed circuit
Reduce energy consumption by 50%
Optical transmission on a printed circuit
Optical chip assembly on glass panel
Waveguide patterning on glass panel
To assemble optical chips on a waveguide embedded glass panel laser structuring was done.
Karlsruhe School of Optics & Photonics (KSOP)
Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882
5
Laser Structuring
Aim
Facilitate perfect alignment for the optical chips
Reduce misalignment losses
Reduce coupling losses by high quality
facet
Process:
Green laser drilling
CO2 laser cutting by crack propagation
Breaking
Karlsruhe School of Optics & Photonics (KSOP)
Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882
Shape geometry after Green laser Drilling
Shape geometry after CO2 laser cutting
40mm
5mm
Aluminium Markers CO2 Laser cut line
6
Process Optimization
Green Laser parameter optimization
Parameters involved
Laser Current
Modulation Speed
Speed
CO2 Laser parameter optimization
Parameters involved
Laser Power
Cut Speed
Breaking Tool
Karlsruhe School of Optics & Photonics (KSOP)
Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882
(a) (b)
Surface quality after (a) Green (b) CO2 laser parameter optimization
7
Results
High quality optical interface
Almost perfect positioning of the cut
Karlsruhe School of Optics & Photonics (KSOP)
Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882
568µm
92µm
8
Summary
Green laser and CO2 laser parameters were successfully optimized
High quality interface and almost perfect positioning of the cut was achieved
Some improvements in the breaking process and the breaking tool are still possible
Karlsruhe School of Optics & Photonics (KSOP)
Schlossplatz 19 | 76131 Karlsruhe (Germany) | Phone: +49 (0)721 608 7880 | Fax: +49 (0)721 608 7882