R&D lines @ IFCA

Jornadas Futuros Aceleradores, Barcelona May8th ‘09

R&D lines @ IFCA

Iván Vila Álvarez Instituto de Física de Cantabria

Main Actors, Roles & R&D communities

Physicists: Celso Martínez, Alberto Ruíz, Marcos Fernández, Amparo L. Virto & Iván Vila

Students: Jordi Duarte + new student. Engineer: David Moya (mechanics),

Richard Jaramillo (electronics) and J. Gonzalez (software).

R&D playgrounds: EUDET, SiLC, CEC (CMS upgrade), Spanish groups.

2Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila


Outline: R&D lines

R&D on sensors Improved IR-semitransparent sensors. Thin micro-strips sensors. Strixels sensors

R&D on mechanics Integration of Fiber Optic Sensors on CF composites Mechanical design and FEA simulation.

DAQ software DAQ integration with EUDET pixel telescope (EUDAQ)

Facilities Outlook and next steps

R&D on Sensors4Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila


RD on Sensors: IRuS for alignment

Statement of the issue: Real time position monitoring of the tracker during

detector operation with a few microns accuracy. Reference laser lines going through tracker’s sensors. Name of the game, increase the IR transmittance of

the microstrip sensors introducing minimal modifications to the sensor layout: same materials, avoid fine tuning.

R&D targets: ILD FTD, SiD tracker, CMS tracker upgrade.


RD on Sensors: IRuS for alignment (2)

1st Validation of optical simulation software with material samples. (done)

2nd Babysensor baseline design (p on n; AC coupling, 50 um pitch) minimal design modifications to boost sensor IR transmittance. (done)

3th Production of IR mini-sensors. (on progress) 4th Bench and beam testing of sensors 5th Know-how transfer to main vendors.

Difference calibrated-fitted thickness= 2 nm

• Simulation predicts calibrated thickness of 6 calibrated bands of SiO2 [d=0-500] nm on a 1-sided polished Si wafer,

from Ocean Optics

• Si characterized from 1st band (not shown)

Difference calibrated-fitted

thickness= 1 nm !!

CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 9

Validation of the optical simulation (1)


CNM wafer + diffraction Al pattern, using GICSERV07 access.

40 diffraction orders45 nm Al roughness

CEC Meeting, Apr 09 - Marcos Fernandez -IFCA 12

Validation of Full Optical Simulation (diffraction pattern)


IR transparent mini-sensors Final-Design

Currently being produced (GICSERV08)


R&D on sensors: thin ustrips

GICSERV09 access on ustrip thin sensors.

Direct wafer bonding and deep anisotropic etching.

Aim: frame layout design, FEA analysis, mechanical characterization of dummies, bonding tests, bench & test beam testing.

R&D Targets: CMS upgrade


Figure 2: Thinning of double-sided processed detectors. See text and ref. [6] for further details.

R&D on Sensors: CMS upgrade HPK Run


AachenDESY

HamburgKarlsruheLouvain

SantanderViennaVilnius

Warsaw

Pixel cells

R&D on sensors: HPK sensors


6 each

6


R&D on Mechanics

System DesignForward Tracker Disk @ ILDOuter layers already on official ILD full simulation geometry.


R&D on mechanics (1)

R&D mechanics: Alignment Requirements

LICTOY tracking simulation software from HEPHY


SiD LoI geometrySingle muon events.

R&D on mechanics: Alignment requirements


DPt/Pt vs. alignment errors 1um, 7um, 10um (5um nominal)


R&D on mechanics(2): SMART structures

Well know monitoring technologies in aeronautics and civil works based on optical fiber sensors (OFS)

Distributed strain & temperature sensors are conventionally used for structure health monitoring : SMART structures

Other OFS for acceleration & radiation dose and rate.

In aeronautics (embedded or bonded) on the of the CFRP composite ( for instance, plane radar redome)


R&D on mechanics: Bragg grating

Fiber Bragg Grating optical transducer very common to measure strain and temperature

R&D on mechanics: Bragg grating


OFS & FBG advantages



Integrating OFS & carbon fiber composites

For the Track structure would be interesting to use a embedded fiber optic sensor. more precise and reliable data

It could be use 2 side solution Better understanding of the

results Useful to quantify the thermal

strain

Plans

R&D Targets: ILD, SiD, SCMS, SBelle Current activities:

Market survey and contact with OFS vendors Contacting CF producers (Inta, Fermilab,…)

Next activities: Testing of standalone OFS. Prepare CFRP test samples with embedded OPS Preparing some CF test structures with bonded or

embedded fibers. Mechanical and thermal characterization of the test

structures.



R&D on Daq S/W

DAQ software : EUDAQ Framework

Integration of SiLC and CMS APV25 r/o software with EUDET telescope f/w.

As members of the EUDET project we have been active users of the “EUDET pixel telescope” .

We have carry-out the its integration with other daq and trigger DUT (thanks to EUDAQ software from the University of Geneva)


CmdReceiver

CmdReceiver

DataReceiver

CmdReceiver

CmdReceiver

DataSender

GUI CmdSender

LogServer

CmdServer

HardwarePolling

DataServer

LogReceiver

Storage

Run Control

Logger

Producer

MonitorData Collector

Hardware

DataMerge

Storage

GUI

GUI

M

N

1

1

1

DataSender

MN

Application

Thread

Buffer

Key:

ListeningSocket

Command Data

Logging

Signal/data

Hierarchy, distribution and communication between applications:

• DAQ software: C++• Communication: POSIX• GUIs: Qt• Online Monitor: ROOT

• Runs on Mac OS X, Linux, and Windows (using cygwin).• Highly modular. Easy integration of devices into the DAQ.

EUDAQ FRAMEWORK


Short-term Outlook

In 2009: Increase our participation on SiD and ILD tracking

groups. The IR alignment sensor fully tested with laser and

source test bench using ALIVABA electronics. Maybe test beam.

Thin sensors produced, mechanical dummies tested. Improved mechanical design. OFS proof of principle for tracking deformation

monitoring. HPK order in production. SCMS and SiLC test beams.


THANK YOU


BACKUP30Jornadas Sobre Futuros Aceleradores , May 8thl '09, I. Vila

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Naïve FEA model

Simple Geometry with frame + thinned area.Support: Four corners fixed.All Silicon structureMeasured dummy structure shows 20 um bow

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Naïve FEA: gravitational bend

Gravity parallel to Z axisDeformation in Z directionMax deformation 12 um

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Naïve FEA: Longitudinal (X) strain

Top surface

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Naïve FEA: Transversal (Y) strain

Top surface

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Naïve FEA: Strain vs. Deformation

0.00E+00 5.00E-06 1.00E-05 1.50E-05 2.00E-05 2.50E-05 3.00E-050.00E+00

2.00E-05

4.00E-05

6.00E-05

8.00E-05

1.00E-04

1.20E-04

1.40E-04

Z DOF / X STRAIN DIFERENT g´s

X STRAIN

Z DO

F

0.00E+00 5.00E-06 1.00E-05 1.50E-05 2.00E-05 2.50E-05 3.00E-050.00E+00

2.00E-06

4.00E-06

6.00E-06

8.00E-06

1.00E-05

1.20E-05

Y STRAIN / X STRAIN DIFERENT g`s

X STRAIN

Y ST

RA

IN

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Naïve FEA: Conclusions

Gravitation bend depends linearly with top surface strain

Output values for nominal conditions: Maximum deformation of 12 um Maximum longitudinal strain about 2.5 me at the

middle of the DEPFET “frame”. Maximum transversal strain about 1 me at the middle

of the DEPFET “frame”.

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A possible commercial solution

Deformation monitoring with 750nm resolution

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An event cleaner/lighter solution ?

Several options: Embdeding of fiber sensors on suporting structures

(BTeV)

Or event much better, embedding the sensing element on the depfet frame,Integrating a Bragg grating on it, still studying its feasibility.

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Summary and next steps

FBG commercial sensor will provide 750nm monitoring resolution with small amount of extra material.

More realistic FEA simulations are still needed: thermal loads, better mechanical supports,…

Eventually, a realistic test with a mock-up will be needed.

R&D lines @ IFCA

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